AP-2-8-INV

R&D of SCSC cables (Spiral Copper-plated Striated Coated-conductor cables) and prospect of their applications to rotating machines

15:15-15:45 28/11/2023

*Naoyuki Amemiya1, Yusuke Sogabe1, Yuta Tejima2, Hidekazu Hara2, Hisaki Sakamoto3
1. Kyoto University, Kyoto, Japan
2. Furukawa Electric Co., Ltd., Nikko, Japan
3. SuperPower Inc., Glenville, NY, U.S.A.
Abstract Body

We have been developing the Spiral Copper-plated Striated Coated-conductor cables, abbreviated to the SCSC cables or the double “SC” cables. The combination of filamentizing (striating) coated conductors and winding them spirally plays similar role to that of filamentizing and twisting of low Tc superconductors. The advantages of SCSC cables are smaller magnetization loss as well as small magnetization itself (smaller error field), large current carrying capacity due to assembling many coated conductors, and mechanical flexibility.

Using a reel-to-reel cabling machine installed at Kyoto University, we successfully fabricated a 5 meter-long four-layer cable which consists of twelve 10-filaments 2 mm-wide coated conductors and whose outer diameter is about 4 mm. We also measured magnetization losses using a short sample cable and showed the one-tenth reduction of magnetization losses as compared to a single standard 4-mm wide coated conductor. Another short six-layer sample cable consisting of eighteen 10-filaments 2 mm-wide coated conductors carried 1 kA peak of current at 50 Hz in liquid nitrogen.

We also conducted conceptual designs of windings for rotating machines such as the stator winding of a motor for aircraft propulsion and the field winding of a rapid-response turbine generator in order to show the prospect of the applications of SCSC cables to various rotating machines.

References

1. N. Amemiya et al. Supercond. Sci. Technol. 35(2022)025003, doi: 10.1088/1361-6668/ac3f9c
2. N. Amemiya et al., IEEE Trans. Appl. Supercond. 33(2023)4701507, doi: 10.1109/TASC.2023.3251305.

Acknowledgment

This work was supported by JST-Mirai Program Grant Number JPMJMI19E1, Japan.

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