WB-P-4

Electromagnetic field analysis and performance improvement of SUAM model by using superconducting tape ribs

16:45-18:15 29/11/2023

*A. Nakato, S. Iwasaki, E.S. Otabe, S. Yamamoto, K. Matsuo, K. Suzuki
Kyushu Institute of Technology, Fukuoka, Japan
Abstract Body

Hollow processing technology which is based on magnetic levitation technology, utilizes the repulsive force caused by the pinning effect, requires to form parts easily in a short time. To solve this situation, we have focused on superconductive-assisted machine (SUAM) that is mainly composed of superconducting bulks and permanent magnet [1]. In our previous work [2], SUAM with superconducting tapes performed well as SUAM with superconducting bulks. Therefore, we considered that it is necessary to evaluate the performance of SUAM using superconducting tapes.

In this study, we used the application, JMAG-Designer 22.1, for the finite element method (FEM) to analyze basic electromagnetic field. We created two different models with 6 sheets in one layer, 72 mm long, 12 mm wide, 2 μm thick, and with the ribs, 65 mm long, 12 mm wide, 2 μm thick. Here, rib is the tape structure placed perpendicularly to flat tapes to obtain larger repulsive force. We analyzed 1, 5, and 10 layers which is placed at 10 mm below the permanent magnet. Fig. 1(a) shows the calculation result for two models with 1, 5 and 10 layers of superconducting tapes with ribs and without ribs using single magnet, and Fig. 1(b) shows the result using double magnets. By comparing these results, until 6 mm, the model with ribs get better repulsive force than without ribs. This is because, the flow of magnetic flux, which extend outward into the surrounding space and loop around, enters perpendicularly to the ribs.

Fig. 1 Repulsive force when the magnetize distance is 1 – 10 mm for with ribs and without ribs for 1, 5, and 10 layers (a) using single magnet and (b) using double magnets.

References

[1] Kinoshita Y, Zhang R, Otabe E S, Suzuki K, Tanaka Y, Nakashima H, Nakasaki T 2020 J. Phys.: Conf. Ser. 1590 012023
[2] Iwasaki S, Kinoshita Y, Ishii H, Otabe E S, Suzuki K, Nakasaki T 2022 J. Phys.: Conf. Ser. 2323 012025

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